On August 8, the 2026 AI Network Technology Application Innovation Conference themed “Empowerment through Open Source, Symbiosis of Intelligent Networks” grandly opened at Langli West Mountain Garden Hotel in Beijing. Guided by the Technical Committee on Information Communication Networks and the Open Source Technology Committee of China Institute of Communications, the conference was hosted by Jiangsu Future Networks Innovation Institute and undertaken by Jiangsu Zhiwang Technology Co., Ltd. It facilitated in-depth exchanges covering cutting-edge advances, industrial implementation and standards formulation of AI network technologies.
As a leading domestic DPU chip solution provider, Resnics was invited as a key participant in the conference. During the event, the company showcased its self-developed Stargate series smart NIC products. Meanwhile, through a keynote speech, Resnics delivered an in-depth interpretation of the core technologies and product advantages of the Stargate-C3000 fully domestic smart NIC chip.
In-depth Sharing: Resnics C3000 Fully Domestic Chip
At the summit, Mr. Tang Jie, Vice President of Solution at Resnics, delivered a keynote speech titled Resnics C3000 Fully Domestic Chip. He introduced that the self-developed Stargate-C3000 fully domestic smart NIC chip targets the substitution of imported NIC chips, with performance comparable to products from leading international vendors. The chip supports configurations of 2×100G and 2×25G, and is also compatible with mainstream rate specifications including 4×10G and 4×25G.
Designed drawing on advanced concepts from open-source communities, the Stargate-C3000 lowers barriers for end users. It provides cloud-native interfaces and native PCIe management tools. Multiple driver loading schemes are available to meet customer demands across diverse scenarios. Optimized for packet forwarding offloading, user-space polling, SPDK and RDMA storage applications, the Stargate-C3000 enables seamless integration with mainstream community solutions and reduces deployment and development costs for users.
The chip integrates Resnics’ self-developed cloud-native P4 programmable network architecture. For advanced users, the RDK (Resnics Software Development Kit) is available with exposed programmable interfaces. In addition, it adopts an RDMA design compatible with NVIDIA ConnectX-6DX, supporting seamless interconnection with ConnectX-6DX devices, and recognizes probe packets of ConnectX-6DX for RDMA flow control. In AI scenarios, it supports GDR, GDS and GDA to enable high-efficiency communication with GPUs.
Spotlight at Exhibition Booth Drawing Widespread Industry Attention
Resnics, a frontrunner in domestic DPU development, maintained high popularity at its booth throughout the conference. Numerous industry guests visited the booth to exchange insights on technological iteration, scenario deployment and new trends of domestic substitution for homegrown chips.
Leveraging its fully domestic core technologies, Resnics stood out prominently at the conference, fully demonstrating the robust capabilities of domestic chips and emerging as a benchmark enterprise for localized development at this event. Boasting fully self-developed technologies free from overseas dependencies, Resnics continues to fill technical gaps in the field of domestic smart NIC chips and advance the autonomy and controllability of the computing power industrial chain. Going forward, Resnics will remain committed to localized innovation, continuously refine its core domestic products, accelerate the large-scale deployment of domestic network chips, and drive high-quality localized development of the AI computing power industry.